Hitachi develops new heat transfer plastic

Hitachi, Japan, has recently developed a new type of epoxy resin with good heat transfer performance, and its maximum thermal conductivity is close to 1.0 times that of the existing epoxy resin.
Heat is a common phenomenon in the work of electronic devices and electrical equipment. Since internal heat is difficult to spread outward, overheating of electronic devices and electrical equipment often occurs. However, if this plastic, which is easy to transfer heat, is used, this problem can be solved and the manufacturing cost can be reduced. Because newly developed heat-transfer plastics provide fast heat dissipation and low thermal resistance, when used in generator coils, the complex water cooling method can be changed to air cooling, thus miniaturizing and lightening the equipment. Insulating sheets, substrates, etc. can also be replaced with hard ceramics that are easy to process lightweight plastics. Therefore, this new type of heat transfer plastic also contributes to miniaturization of electronic devices.
According to reports, this new type of heat transfer plastic has a certain degree of transparency, its thermal expansion coefficient is also relatively low, easy to bond, and has a suitable molding performance.